Solder Paste QFN350 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. QFN350 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation.
Read MoreSend InquiryThermal Conductive Pad for CPU Typical applications for Thermal pad TS300 LED lighting, lighting equipment Household appliances, LCD monitors Between the semiconductor and the heat sink. Communications products, smart phones, tablet PCs Desktop computers, notebooks and other portable computers. High power Electrical appliances power supply.
Read MoreSend Inquiry